1. Intelligent temperature control 2. Protect Motherboard, Desoldering PCBA Easily 3. Dual button design, adopting intergrated design of PCBA soldering and desoldering 4. Support: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max 5. Adopting AC high-frequency heating, PID temperature algorithm, temperature rising faster and more accurate. 6. Adopt Magnetic Flip design, start dormancy mode by automatic induction, better protection for users. 7. Adopting Layer-Fit Integrated Design Scheme, to stretch the deformed PCBA easily for heating fit by buckle lock.
